Electroplated nickel gold is more typically used on IC substrates (like PBGA), predominantly for binding gold wires and copper wires; but when electroplating C substrates, additional conductive wires have to be produced at the gold finger binding place ahead of electroplating. The metal layers to the multilayer PCB will perform https://10-layer-2-order-hdi-mult83715.izrablog.com/31969107/top-latest-five-four-layer-inner-and-outer-layers-2oz-copper-thick-pcb-circuit-board-urban-news